Manufacturer & Trading Company
Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
USD 20000,00 – 60000,00
/ piece
Цена зависит от количества и характеристик
| Мин. кол. | 1 piece |
| Категория | Machinery |
19
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Ответ
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Описание товара
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Технические характеристики
| Model NO. | FD220 |
| After-sales Service | 12months |
| Warranty | 12months |
| Type | Surface Grinding Machine |
| Processing Object | Flat Workpieces |
| Abrasives | Grinding Wheel |
| Controlling Mode | PLC |
| Automatic Grade | Semiautomatic |
| Cylindrical Grinder Type | Surface Grinding Machine |
| Precision | High Precision |
| Certification | ISO 9001 |
| Condition | New |
| Power Source | Electricity |
| Disc(Wheel) Type | Grinding Disc |
| Variable Speed | with Variable Speed |
| Application | Semiconductor Industry |
| Service | Oversea Setup & After-Sale Avalaible |
| Class | Thinner |
| Process Station | 1 |
| Abrasive | Recyclable Water & Grinding Wheel |
| Wheel Rotate Speed | 0-3000 Rpm |
| Workpiece Accuracy Control(Parallelism) | 1um |
| Power of Grinding Wheel Motor | 5.5kw |
| Transport Package | Wood Crate |
| Trademark | PONDA |
| Origin | China |